I NTEGRATED C IRCUITS D IVISION
CPC1978
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
CPC1978J
Moisture Sensitivity Level (MSL) Rating
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard
JESD-625 .
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
CPC1978J
Maximum Temperature x Time
245°C for 30 seconds
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e 3
R07
www.ixysic.com
6
相关PDF资料
CPC1979J RELAY 600V 1.4A ISOPLUS264
CPC1981Y RELAY POWER SPST 180MA 4-SIP
CPC1983Y RELAY OPTO SP-NO 600V POWERSIP
CPC1986J RELAY 1000VAC/DC 0.7A I4PAC
CPC1988J RELAY 1000V 0.9A ISOPLUS264
CPC1998Y RELAY SSR AC POWER SWITCH 4-SIP
CPC2014N RELAY OPTOMOS DUAL SP 8-SOIC
CPC2017N RELAY SSR OPTOMOS DUAL NO 8-SOIC
相关代理商/技术参数
CPC1979 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS?-264 Power Relay
CPC1979_11 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS?-264 Power Relay
CPC1979J 功能描述:固态继电器-PCB安装 SPST iso PLUS-264 RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC1981 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:OptoMOS? Power SIP Relay
CPC1981_11 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:OptoMOS? Power SIP Relay
CPC1981Y 功能描述:固态继电器-PCB安装 Single Pole Power SIP RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC1983 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:OptoMOS? Power SIP Relay
CPC1983B 功能描述:IC RELAY SP-NO POWERSIP 制造商:ixys integrated circuits division 系列:* 零件状态:有效 标准包装:25